FSPG HI-TECH - Professional metallization film manufacturer
FSPG HI-TECH manufactures metallized films specifically for power capacitors. We can provide metallized film solutions based on a variety of substrates to meet your specific application needs.
Base Film for Metallized
Metallization film underpins new-energy power electronics as a low-loss, self-healing dielectric in DC-link and filter capacitors, boosting efficiency, reliability, and service life. As a key high-tech enterprise, we are dedicated to producing fundamental materials for a variety of industrial applications. Whether it's metallization film or the base film used to manufacture it, at FSPG HI-TECH, we have it all.
Product Center
Metallized Base Film Type
We can provide metallized film solutions based on a variety of substrates to meet your specific application needs.
MP-1 metallized base film
A capacitor-grade BOPP base film engineered as the dielectric substrate for vacuum metallization. MP-1 balances metallization stability, winding runnability, and cost for high-volume production of general-purpose metallized film capacitors. General DC/AC film capacitors used in power supplies, filters, and industrial electronics where ambient to moderate temperatures apply.
MP-H metallized base film
A high-temperature BOPP base film tailored for metallized capacitors operating under elevated temperature and humidity. MP-H retains the uniformity and metallization friendliness of MP-1 while adding enhanced heat and damp-heat resistance (target up to ~105 °C class), supporting long-life performance in harsher duty cycles. DC-link, AC filtering, and snubber capacitors located near heat sources or running at higher RMS ripple—typical in EV/HEV powertrains, fast chargers, PV/ESS inverters, and heavy-duty drives.
Technical Specifications
Learn More About the Metalized Base Film.
MP-1 metallized base film
Key features Surface options: single-side or both-sides hazy for controlled slip, coil tightness, and uniform metal adhesion. Process consistency: tight thickness profile, controlled roughness/porosity, and low defect density to reduce pinholes and improve yield. Electrical stability: dielectric strength and low loss appropriate for mainstream metallized PP designs. Typical specifications Thickness range: ~2.4–12 μm (series coverage). Material: biaxially oriented polypropylene (BOPP), capacitor grade. Process notes & QA checkpoints
MP-H metallized base film
Key features High-temp endurance: stable dielectric and dimensional behavior at elevated temperature; improved resistance to moisture-induced drift. Metallization stability: consistent thickness/roughness/porosity for uniform deposition and controlled self-healing behavior after winding. Reliability oriented: supports designs targeting extended service life and tighter lifetime derating. Typical specifications Thickness range: ~2.4–12 μm (series coverage). Material: capacitor-grade BOPP with high-temperature formulation. Process notes & QA checkpoints
Application
MP-1 – DC-Link Filtering in Industrial PSUs/VFDs
Used in indoor switch-mode power supplies and small-to-mid power VFD/servo drives to provide DC-link energy storage and ripple smoothing. Under moderate ambient and ripple current, MP-1 delivers low loss and stable winding behavior at an attractive cost-performance ratio.
MP-H – DC-Link Main Storage in EV Traction Inverters
Deployed near power modules in EV/HEV inverters and fast chargers to handle high ripple current and high dv/dt under elevated temperature and humid, cycling conditions. MP-H’s higher heat and damp-heat endurance safeguards long-life reliability in harsh duty.
Shared Application: DC-Link and AC Filtering in PV/ESS Inverters
Both films are suitable for PV/energy-storage inverters. Choose MP-1 for indoor systems with good thermal management and moderate loading; choose MP-H for outdoor/high-temperature or continuous heavy-load operation to extend lifetime margins.
How Metallization Film Is Made
Make & Orient the Base Polymer
Polypropylene resin is extruded and biaxially oriented to form thin, uniform bopp film (typically 2–12 µm). Orientation sets the dielectric strength and dimensional stability required for capacitor and electronics use.
Prepare the Metallization Base Film
The oriented film is converted into a Metallization Base Film: cleaned and dried, corona/primer treated, and finished to a specified haze/roughness profile. Moisture, defects, and thickness profile are tightly controlled so the metal layer will anchor uniformly and the film will wind smoothly.
Vacuum-Deposit the Metal
Inside a high-vacuum coater, aluminum (or Al-Zn) is evaporated and deposited onto the film. Process parameters are tuned to the target sheet resistance (Ω/□), adhesion, and coverage. The result is continuous or segmented electrodes—this is the moment the material becomes Metalized Films (i.e., metallized film).
Post-Process, Convert, and Qualify
The metallized roll is heat-stabilized/annealed, edge-etched (to form insulation margins), optionally over-coated, then slit to width. Each lot is qualified (pinhole rate, adhesion/peel, resistance mapping, shrinkage), packed with full traceability, and supplied for winding into capacitors or for EMI/shielding laminates.
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